Introduction of Bonding Technologies for 3D Integrations
نویسندگان
چکیده
منابع مشابه
Low temperature bonding technology for 3D integration
0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.03.038 ⇑ Corresponding author. E-mail address: [email protected] (K.-N. C 3D integration provides a promising solution to achieve system level integration with high function density, small form factor, enhanced transmission speed and low power consumption. Stacked bonding is the key technology to enable the comm...
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ژورنال
عنوان ژورنال: Vacuum and Surface Science
سال: 2019
ISSN: 2433-5835,2433-5843
DOI: 10.1380/vss.62.672